MILPITAS, CA – December 2017 – Flex Interconnect Technologies (FIT), a leader in the design, manufacture and assembly of flexible printed circuits, announces that it has purchased a second building next to its current facility to expand its operations.

The purchase of the second building will help FIT double its manufacturing capacity and add additional equipment and services to support the customers’ growing needs. The investment in purchase of the building also ensures that FIT can control its own destiny in the future.

“We have been growing at an average rate of nearly 30% year-over-year for the last 19 years, and have continued to expand our manufacturing space and investment in equipment. We welcome our customers to come and visit our new expanded facility and streamlined operation.” said Chetan Shah, CEO of Flex Interconnect.

In addition to ISO 9001:2008, AS9100 Rev C and UL certification

MILPITAS, CA — January 2013 — 2012 was a growth year for Flex Interconnect Technologies (FIT). With all the uncertainties in the world market as well as election year, there was a slowdown in the business that was felt by the Printed Circuit Industry. Fortunately we were able to win many new programs and ending the year with nearly 10% growth.

FIT is now offering Samtec’s standard high-speed Data Link flex cables, build to exact Samtec specifications, materials and processes. This product line offering in 2012 is one of the contributors for our growth. Along with this new standard flex cable line, FIT also designs, manufactures and assembles custom flex and rigid-flex technology to both IPC-6013 class 3 and Mil-P-50884 specifications.

The outlook for 2013 is very bright for FIT with the acquisition of a lot of new Military, Aerospace, Medical and Commercial customers during 2012. FIT invested in new equipment, made improvements in operating efficiencies and hired 15% more employees during 2012. This has helped increase the capacity by 30% to support the growth we expect to see in 2013.

FIT is AS9100C, ISO9000-2008, FDA QSR 820B and ITAR certified. FIT is capable of producing reliable prototypes from Schematics to complete Turnkey Assembly in 10 days or less, while meeting stringent quality and traceability requirements. 

With our manufacturing capabilities and top-notch engineering expertise, we feel we are well positioned to support the needs of customers who demand top quality, excellent service at a rapid speed. We look forward to a great 2013.

Chetan Shah, President & CEO, Flex Interconnect Flex Interconnect

Full Article available at  http://www.circuitnet.com/articles/article_94027.shtml

MILPITAS, CA — January 2013 — Flex Interconnect Technologies (FIT), a leader in the design, manufacture and assembly of flexible printed circuits, announces that it has been re-certified by Lockheed Martin Missiles and Fire Control as its approved supplier for producing flex and rigid-flex circuits to IPC-6011 class 3 and IPC-6013 class 3. FIT manufactured flex boards had the rating of 100 percent on time delivery and 100 percent quality.

The certification allows FIT to continue to produce parts for all of the Lockheed Martin divisions as well as the company’s Tier 1 suppliers. To accomplish this, FIT demonstrated that its quality system conforms to both AS9100C standards and the company completely implemented IPC-6011 class 3 and IPC-6013 class 3 specifications as part of its day-to-day operations in manufacturing flexible circuits.

“Lockheed Martin has been wonderful to us. They are a great partner and have played a key role in driving us to maintain the highest level of quality in our parts and our service. We are honored to have the continued opportunity to work with them,” said Dean T. Matsuo. CTO of Flex Interconnect.

In addition to ISO 9001:2008, AS9100 Rev C and UL certifications, FIT also is ITAR certified. All manufacturing for FIT is completed right here in the United States and the company continues to contribute to rebuilding the American economy.

MILPITAS, CA — January 2013 — Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announces that it will be exhibiting in Booth #423 at the upcoming Medical Design & Manufacturing (MD&M) West Exposition, scheduled to take place February 12-14, 2013 at the Anaheim Convention Center in Anaheim, California.

FIT will exhibit its new high-speed standard DATA LINK flex cable lines with Samtec connectors. The high-speed cables are standard stock items, but also can be customized to fit specific customer needs. The flex cables are produced with materials and processes that meet signal integrity and product reliability characteristics.

In addition to ISO: 2008 Rev C, AS9100 and UL certifications FIT also is ITAR certified. All manufacturing for FIT is completed right here in the United States and the company continues to contribute to rebuilding the American economy.

Flex Interconnect Technologies provides complete engineering support, design layout, quick-turn prototypes, volume production and turnkey assembly. For more information, please stop by booth #423 at the MD&M West Exposition or visit  www.fit4flex.com.

January 6, 2010 – Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announced today that its annual revenue grew by 6% even in the challenging 2009 year. In addition, the company added employees in 2009 growing by 11%, as well as invested in capital equipment to support customer requirements and stay ahead on the technology roadmap.

FIT has been recognized as one of the top-50 fastest growing privately held companies in the Silicon Valley for three years. Company revenues have continuously grown 10 out of its 11 year history at aggregate growth rate of 41.5%. FIT’s growth is driven by its commitment to providing unique value added solutions to its customers with certified quality and on-time delivery.

November 30, 2009 – Electronic Interconnect (EI), a leading solutions provider for all aspects of flexible printed circuitry, announced a cooperative agreement with Electronic Interconnect (EI) to jointly provide a wider range of PCB products to their customers. EI specializes primarily in rigid PCB types, while FIT is a leader in providing complete end-to-end flexible circuits, Rigid-flex and HDI flex solutions, from design and manufacturing to final assembly.

In making the announcement, Pratish Patel, EI President and CEO, said, “This cooperation between EI and FIT directly benefits our customers by offering a wider range of PCB technologies from our individual specializations. FIT is a recognized leader in flex and rigid-flex boards, and we specialize in rigid PCBs for leading-edge applications, such as products requiring thermal management and specialized materials and designs. By bringing our talents together, we can now offer the customer an unsurpassed range of technical expertise in advanced PCB technology.”

March 11, 2009 – Flex Interconnect Technologies (FIT), a leading solutions provider for all aspects of flexible printed circuitry, announced today that Raj Badoni has been named its new Director of Sales and Marketing.

“Raj’s extensive background in the semiconductor industry, and blend of technical and business management experience will be instrumental in strengthening our existing customer relationships, and developing new ones,” said Chetan Shah, FIT’s Co-founder and President.

October 21, 2008 – Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announced today that they have received official International Traffic in Arms Regulations (ITAR) registration from the US Department of State. The registration recognizes Flex Interconnect Technologies’ adherence and commitment to the regulations that control the export and import of defense related articles and services. ITAR compliance ensures that Flex Interconnect Technologies has the capabilities, expertise and regulatory oversight to properly handle the manufacturing of Military, Defense and Aerospace technology.

March 18, 2008 – Flex Interconnect Technologies (FIT), a leader in design, manufacture and assembly of flexible printed circuits, announced today that its Quality Management System is certified to AS9100 revision B standards. The AS9100 revision B is a standard developed by International Aerospace Quality Group (IAQC).

The certification of Flex Interconnect Technologies was granted after intense audit by Intertek Systems, one of the most reputed Registrars of Aerospace standards. Flex Interconnect Technologies passed the audit with a perfect 100% score.

March 1, 2004 – Flex Interconnect Technologies (FIT), Inc. has expanded to a new 15,000 sf facility. This state of the art facility will support the growing customer base and strategic partners. 

Dean Matsuo, Vice President stated, “Flex Interconnect has been growing on an average 60% per year over the last 5 years. The new facility and equipment as well as new hires will help us increase our capacity three-fold. It will also allow us to support the quickturn prototype as well as production needs of our customers.”

February 18, 2004 – Flex Interconnect Technologies (FIT), Inc. has been selected by Samtec to support their customers needs for prototype and pre-preproduction quantities of flex and rigid-flex circuits.

Chetan Shah, President stated, “We are proud of our strategic alliance with Samtec to support their customers’ quickturn prototype requirements for on-time quality flex circuits.” 

Chetan Shah, President stated, “Network Electronics Marketing bring years of experience, technical knowledge and unsurpassed devotion to customer service that harmonizes with the philosophy of FIT to provide total customer satisfaction.”