FIT CAPABILITIES
| Description | Standard | Advanced | Premium |
| Number of Layers | 1 to 14 | 14 to 18 | 18+ |
| Trace Width - 0.5 oz. copper | 3 mils and above | 2.5 mils | 2 mils |
| Trace Width - 1.0 oz. copper | 6 mils and above | 5 mils | 4 mils |
| Smallest Hole Size - mech. drilled | 8 mils | 6 mils | 4 mils |
| Smallest Hole Size - laser drilled | 4 mils | 3 mils | 2 mils |
| Aspect Ratio - PTH | 8:1 max | 10:01 | over 10:1 |
| Aspect Ratio - blind microvia | 1:1 max. | 1.25:1 | 1.5:1 |
| Minimum Pad Size - internal layer | DHS + 16 mils | DHS + 12 mils | DHS + 10 mils |
| Minimum Antipad Size | DHS + 28 mils | DHS + 20 mils | DHS + 15 mils |
| Minimum Pad Size - button plating | DHS + 20 mils | DHS + 14 mils | DHS + 12 mils |
| Minimum Pad Size - pattern plating | DHS + 14 mils | DHS + 12 mils | DHS + 10 mils |
| Minimum Soldermask Clearance | 4 mils per side | 3 mils per side | 2 mils per size |
| Minimum Soldermask Webbing | 8 mils | 6 mils | 4 mils |
| Minimum Coverfilm Webbing | 12 mils | 10 mils | 8 mils |
| Allowable Squeezeout per Side | 4 mils/mil | 3 mils/mil | 2 mils/mil |
| Impedance Control Tolerance | +/- 15% | +/- 10% | +/- 5% |
Note: DHS (drilled hole size) is typically larger than FHS (finished hole size) by 5 mils for component holes. For vias DHS can be the same size as FHS.