FIT CAPABILITIES

Description Standard Advanced Premium
Number of Layers 1 to 14 14 to 18 18+
Trace Width - 0.5 oz. copper 3 mils and above 2.5 mils 2 mils
Trace Width - 1.0 oz. copper 6 mils and above 5 mils 4 mils
Smallest Hole Size - mech. drilled 8 mils 6 mils 4 mils
Smallest Hole Size - laser drilled 4 mils 3 mils 2 mils
Aspect Ratio - PTH 8:1 max 10:01 over 10:1
Aspect Ratio - blind microvia 1:1 max. 1.25:1 1.5:1
Minimum Pad Size - internal layer DHS + 16 mils DHS + 12 mils DHS + 10 mils
Minimum Antipad Size  DHS + 28 mils DHS + 20 mils DHS + 15 mils
Minimum Pad Size - button plating DHS + 20 mils DHS + 14 mils DHS + 12 mils
Minimum Pad Size - pattern plating DHS + 14 mils DHS + 12 mils DHS + 10 mils
Minimum Soldermask Clearance 4 mils per side 3 mils per side 2 mils per size
Minimum Soldermask Webbing 8 mils 6 mils 4 mils
Minimum Coverfilm Webbing 12 mils 10 mils 8 mils
Allowable Squeezeout per Side 4 mils/mil 3 mils/mil 2 mils/mil
Impedance Control Tolerance +/- 15% +/- 10% +/- 5%

Note: DHS (drilled hole size) is typically larger than FHS (finished hole size) by 5 mils for component holes. For vias DHS can be the same size as FHS.