FIT CAPABILITIES

MFG. CAPABILITIES STANDARD ADVANCED
Min Trace/Space 75 microns 50 microns
Smallest Mechanical Drill 0.150 mm 0.100 mm
Smallest Laser Drill 0.075 mm 0.050 mm
Max Aspect Ratio 8:1 10:1
Max Blind Via Aspect Ratio 0.7:1 1:1
Min Internal Pad Size DHS + 0.350 mm DHS + 0.200 mm
Min Clearance Pad Size DHS + 0.600 mm DHS + 0.400 mm
Min External Pad Size DHS + 0.250 mm DHS + 0.200 mm
Min Pad Size for Selective Plating DHS + 0.450 mm DHS + 0.400 mm
Min Soldermask Clearance 0.075 mm per side 0.050 per side
Min Soldermask Webbing 0.150 mm 0.100 mm
Min Mask defined Pad Diamete 0.125 mm 0.100 mm
Min Coverlay Clearance 0.200 mm per side 0.125 mm per side
Min Feature-to-Board Edge 0.250 mm 0.075 mm
Number of Layers 1 to 24 up to 30
HDI capabilities Yes Ormet Technology
Max Flex Length 57.15 cm Greater than 58 cm
Via Fill Capability Yes Yes
Max Board Thickness 2.40 mm  3.10 mm 
Min Copper Weight 9 to 18 micron 0.4 to 5 micron
Max Copper Weight 3 oz 4 oz
Shielding Method Copper, Tatsuta, Silver Ink Copper, Tatsuta, Silver Ink
Impedance Tolerance +/- 10% +/- 5%
Assembly BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201
Testing Flying Probe, Functional, JTAG, ICT
Conformal Coating Urethane, Acrylic, Silicone, Paralyne
Surface Finish ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL
Panel Size 9x12, 12x12, 12x18, 12x24

Note: DHS (drilled hole size) is typically larger than FHS (finished hole size) by 5 mils for component holes. For vias DHS can be the same size as FHS.



QUICKTURN CAPABILITIES  
Single Sided 5 days 3 days
Double Sided 5 days 4 days
Multilayer upto 6 layers 7 days 5 days
Multilayer over 7 to 10 layers 10 days 8 days
Multilayer over 10 layers 20 days 15 days
Assembly 3 days 24 hours
Design 4 days 24 hours


MATERIALS Dupont, Taiflex, Thinflex, Panasonic Dupont TK, Dupont LG, Embedded Passives, Tatsuta, Dupont RS, Heater