MANUFACTURING CAPABILITIES |
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Specifications | Standard | Advanced |
Min Trace/Space | 75 microns | 50 microns |
Smallest Mechanical Drill | 0.150 mm | 0.100 mm |
Smallest Laser Drill | 0.075 mm | 0.050 mm |
Max Aspect Ratio | 8:01 | 10:01 |
Max Blind Via Aspect Ratio | 0.7:1 | 1:01 |
Min Internal Pad Size | DHS + 0.350 mm | DHS + 0.200 mm |
Min Clearance Pad Size | DHS + 0.600 mm | DHS + 0.400 mm |
Min External Pad Size | DHS + 0.250 mm | DHS + 0.200 mm |
Min Pad Size for Selective Plating | DHS + 0.450 mm | DHS + 0.400 mm |
Min Soldermask Clearance | 0.075 mm per side | 0.050 mm per side |
Min Soldermask Webbing | 0.150 mm | 0.100 mm |
Min Mask Defined Pad Diameter | 0.125 mm | 0.100 mm |
Min Coverlay Clearance | 0.200 mm per side | 0.125 mm per side |
Min Feature-to-Board Edge | 0.250 mm | 0.075 mm |
Number of Layers | 1 to 24 | Up to 30 |
HDI Capabilities | Yes | Sintering Paste Technology |
Max Flex Length | 57.15 cm | Greater than 58 cm |
Via Fill Capability | Yes | Yes |
Max Board Thickness | 2.4 mm | 3.10 mm |
Min Copper Weight | 9 to 18 micron | 0.4 to 5 micron |
Max Copper Weight | 3 oz. | 4 oz. |
Shielding Method | Copper, Tatsuta, Silver Ink | Copper, Tatsuta, Silver Ink |
Impedance Tolerance | +/- 10% | +/-5% |
Assembly | BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201 | Flying Probe, Functional, JTAG, ICT |
Testing | Flying Probe, Functional, JTAG, ICT | Yes |
Conformal Coating | Yes | |
Surface Finish | ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL |
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Panel Size | 9 x 12", 12 x 12", 12 x 18", 12 x 24" |
QUICKTURN CAPABILITIES |
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Build Type | Standard Lead Time | Advanced Lead Time |
Single Sided | 5 days | 3 days |
Double Sided | 5 days | 4 days |
Multilayer up to 6 layers | 7 days | 5 days |
Multilayer over 7 to 10 layers | 10 days | 8 days |
Multilayer over 10 layers | 20 days | 15 days |
Assembly | 3 days | 24 hours |
Design | 4 days | 24 hours |
MATERIALS |
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Standard | Advanced |
Dupont | Dupont TK |
Taiflex | Dupont LG |
Thinflex | Tatsuta |
Panasonic | Embedded Passives |
ASSEMBLY CAPABILITIES |
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Specifications | Onshore | Offshore |
Build Type | FPC and Rigid Circuits | FPC and Rigid Circuits |
Certifications | ISO13485, ISO 9001, IPC 610 | ISO 9001, IPC 610 |
Standard Lead Time | 5-10 days | 4 weeks |
SMT | Yes | Yes |
Wave Solder | Yes | Yes |
Min Pitch | 0.4 mm | 0.5 mm |
Min component size | 1005 | 0201 |
Rework | Yes | Yes |
Box Build | Yes | Yes |
BGA Rework | Yes | Yes |
AOI | Yes | Yes |
Lead Free Assembly | Yes | Yes |
Leaded Assembly | Yes | Yes |
Flying Probe Test | Yes | Yes |
Conformal Coating | Yes | Yes |
3D Xray | Yes | Yes |
OFFSHORE CAPABILITIES |
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Specifications | Standard | Advanced |
Build Type | FPC and Rigid Circuits | FPC and Rigid Circuits |
Max Number of Layers | 6 | 10 |
Min Trace/Space | .004″ | .003″ |
Smallest Mechanical Drill | .008″ | .006″ |
Min Pad Size | .020″ | .018″ |
Blind/Buried Vias Capabilities | No | Yes |