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Capabilities

Capabilities

MANUFACTURING CAPABILITIES

SpecificationsStandardAdvanced
Min Trace/Space
75 microns
50 microns
Smallest Mechanical Drill
0.150 mm
0.100 mm
Smallest Laser Drill
0.075 mm
0.050 mm
Max Aspect Ratio
8:01
10:01
Max Blind Via Aspect Ratio
0.7:1
1:01
Min Internal Pad Size
DHS + 0.350 mm
DHS + 0.200 mm
Min Clearance Pad Size
DHS + 0.600 mm
DHS + 0.400 mm
Min External Pad Size
DHS + 0.250 mm
DHS + 0.200 mm
Min Pad Size for Selective Plating
DHS + 0.450 mm
DHS + 0.400 mm
Min Soldermask Clearance
0.075 mm per side
0.050 mm per side
Min Soldermask Webbing
0.150 mm
0.100 mm
Min Mask Defined Pad Diameter
0.125 mm
0.100 mm
Min Coverlay Clearance
0.200 mm per side
0.125 mm per side
Min Feature-to-Board Edge
0.250 mm
0.075 mm
Number of Layers
1 to 24
Up to 30
HDI Capabilities
Yes
Sintering Paste Technology
Max Flex Length
57.15 cm
Greater than 58 cm
Via Fill Capability
Yes
Yes
Max Board Thickness
2.4 mm
3.10 mm
Min Copper Weight
9 to 18 micron
0.4 to 5 micron
Max Copper Weight
3 oz.
4 oz.
Shielding MethodCopper, Tatsuta, Silver InkCopper, Tatsuta, Silver Ink
Impedance Tolerance
+/- 10%
+/-5%
Assembly
BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201
Flying Probe, Functional, JTAG, ICT
Testing
Flying Probe, Functional, JTAG, ICT Yes
Conformal Coating
Yes
Surface Finish
ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL
Panel Size9 x 12", 12 x 12", 12 x 18", 12 x 24"

QUICKTURN CAPABILITIES

Build Type Standard Lead Time Advanced Lead Time
Single Sided
5 days
3 days
Double Sided
5 days
4 days
Multilayer up to 6 layers
7 days
5 days
Multilayer over 7 to 10 layers
10 days
8 days
Multilayer over 10 layers
20 days
15 days
Assembly
3 days
24 hours
Design
4 days
24 hours

MATERIALS

Standard
Advanced
Dupont
Dupont TK
Taiflex
Dupont LG
Thinflex
Tatsuta
PanasonicEmbedded Passives

ASSEMBLY CAPABILITIES

SpecificationsOnshoreOffshore
Build TypeFPC and Rigid CircuitsFPC and Rigid Circuits
Certifications

ISO13485, ISO 9001, IPC 610
ISO 9001, IPC 610
Standard Lead Time
5-10 days
4 weeks
SMT
Yes
Yes
Wave Solder
Yes
Yes
Min Pitch0.4 mm 0.5 mm
Min component size
1005
 0201
Rework
Yes
Yes
Box Build
Yes
Yes
BGA Rework
Yes
Yes
AOI
Yes
Yes
Lead Free Assembly
Yes
Yes
Leaded Assembly
Yes
Yes
Flying Probe Test
Yes
Yes
Conformal Coating
Yes
Yes
3D Xray
Yes
Yes

OFFSHORE CAPABILITIES

SpecificationsStandard
Advanced
Build TypeFPC and Rigid CircuitsFPC and Rigid Circuits
Max Number of Layers
6
10
Min Trace/Space
.004″
.003″
Smallest Mechanical Drill
.008″
.006″
Min Pad Size
.020″
.018″
Blind/Buried Vias Capabilities
No
Yes