MANUFACTURING CAPABILITIES
|
| Specifications | Standard | Advanced |
Min Trace/Space
| 75 microns
| 50 microns
|
Smallest Mechanical Drill
| 0.150 mm
| 0.100 mm
|
Smallest Laser Drill
| 0.075 mm
| 0.050 mm
|
Max Aspect Ratio
| 8:01
| 10:01
|
Max Blind Via Aspect Ratio
| 0.7:1
| 1:01
|
Min Internal Pad Size
| DHS + 0.350 mm
| DHS + 0.200 mm
|
Min Clearance Pad Size
| DHS + 0.600 mm
| DHS + 0.400 mm
|
Min External Pad Size
| DHS + 0.250 mm
| DHS + 0.200 mm
|
Min Pad Size for Selective Plating
| DHS + 0.450 mm
| DHS + 0.400 mm
|
Min Soldermask Clearance
| 0.075 mm per side
| 0.050 mm per side
|
Min Soldermask Webbing
| 0.150 mm
| 0.100 mm
|
Min Mask Defined Pad Diameter
| 0.125 mm
| 0.100 mm
|
Min Coverlay Clearance
| 0.200 mm per side
| 0.125 mm per side
|
Min Feature-to-Board Edge
| 0.250 mm
| 0.075 mm
|
Number of Layers
| 1 to 24
| Up to 30
|
HDI Capabilities
| Yes
| Sintering Paste Technology
|
Max Flex Length
| 57.15 cm
| Greater than 58 cm
|
Via Fill Capability
| Yes
| Yes
|
Max Board Thickness
| 2.4 mm
| 3.10 mm
|
Min Copper Weight
| 9 to 18 micron
| 0.4 to 5 micron
|
Max Copper Weight
| 3 oz.
| 4 oz.
|
| Shielding Method | Copper, Tatsuta, Silver Ink | Copper, Tatsuta, Silver Ink |
Impedance Tolerance
| +/- 10%
| +/-5%
|
Assembly
| BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201
| Flying Probe, Functional, JTAG, ICT
|
Testing
| Flying Probe, Functional, JTAG, ICT | Yes
|
Conformal Coating
| Yes
| |
Surface Finish
| ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL
|
| Panel Size | 9 x 12", 12 x 12", 12 x 18", 12 x 24" |
