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E: support@fit4flex.com | T: (408) 635-3544

Research & Development

Research & Development

Research and Development

We have forged a strong partnership with DuPont, Tatsuta, Insulectro, ICT and Averatek, which allows us to explore the newest materials and technologies before they hit the market. These strategic partnerships have enabled us to be the very first FPC company in the world to produce some of the latest technologies listed below. 

 

  DuPont RS and APR Based Heaters

  Hitachi Stretchable Laminate Based Flex Circuit

  DuPont Ultrathin Laminate Based 40 layer Flex with “Any Layer Vias”

  ICT Hinged Flex Circuit

  Zeta-Lock

  HDI flex using Ormet paste and Tatsuta Paste Technology

  Embedded Capacitor in Flex using Dupont Interra Material

  Reinforced Thin Flex with Dupont LG Film

  LED applications using Coolam Laminate

  Adhesiveless Coverlay Based Rigid-Flex

  DuPont MT and MT+ Coverlay for High Thermal Conductivity

  Medical Sensors with 0.4 micron copper

  HDI flex using Ormet paste and Tatsuta Paste Technology

  Embedded Capacitor in Flex using Dupont Interra Material

  Reinforced Thin Flex with Dupont LG Film

  LED applications using Coolam Laminate

  Adhesiveless Coverlay Based Rigid-Flex

  DuPont MT and MT+ Coverlay for High Thermal Conductivity

  Medical Sensors with 0.4 micron copper

DuPont RS and APR Based Heaters

DuPont Ultrathin Laminate Based 40 layer Flex
with ‘Any Layer Vias’

ICT Hinged Flex Circuit

Hitachi Stretchable Laminate Based Flex Circuit