We’ve been perfecting flex and rigid-flex manufacturing for over the past 20 years and a large portion of our employees have been with us since the beginning, averaging a 15-year tenure. This leads to very experienced engineers, operators, technicians, and managers that are specialized in manufacturing flexible circuits.
Our in-house Specialities:
- Flex Printed Circuits
- Flex Circuits with Stiffener
- Rigid-Flex Circuits
We can deliver your flex circuits in the following variations:
- Laser routed into individual boards
- In an array with tab rout, rails, fiducials and tooling holes. An FR4 backer may be added for stability depending on the assembly requirements
- Partially or fully loaded populated circuits so all you have to do is plug and play
| MANUFACTURING CAPABILITIES |
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| Specifications | Standard | Advanced |
| Min Trace/Space | 75 microns | 50 microns |
| Smallest Mechanical Drill | 0.150 mm | 0.100 mm |
| Smallest Laser Drill | 0.075 mm | 0.050 mm |
| Max Aspect Ratio | 8:01 | 10:01 |
| Max Blind Via Aspect Ratio | 0.7:1 | 1:01 |
| Min Internal Pad Size | DHS + 0.350 mm | DHS + 0.200 mm |
| Min Clearance Pad Size | DHS + 0.600 mm | DHS + 0.400 mm |
| Min External Pad Size | DHS + 0.250 mm | DHS + 0.200 mm |
| Min Pad Size for Selective Plating | DHS + 0.450 mm | DHS + 0.400 mm |
| Min Soldermask Clearance | 0.075 mm per side | 0.050 mm per side |
| Min Soldermask Webbing | 0.150 mm | 0.100 mm |
| Min Mask Defined Pad Diameter | 0.125 mm | 0.100 mm |
| Min Coverlay Clearance | 0.200 mm per side | 0.125 mm per side |
| Min Feature-to-Board Edge | 0.250 mm | 0.075 mm |
| Number of Layers | 1 to 24 | Up to 30 |
| HDI Capabilities | Yes | Sintering Paste Technology |
| Max Flex Length | 57.15 cm | Greater than 58 cm |
| Via Fill Capability | Yes | Yes |
| Max Board Thickness | 2.4 mm | 3.10 mm |
| Min Copper Weight | 9 to 18 micron | 0.4 to 5 micron |
| Max Copper Weight | 3 oz. | 4 oz. |
| Shielding Method | Copper, Tatsuta, Silver Ink | Copper, Tatsuta, Silver Ink |
| Impedance Tolerance | +/- 10% | +/-5% |
| Assembly | BGA, uBGA, Hot Bar, ACF Bonding, Flip Chip, Die Attach, 0201 | Flying Probe, Functional, JTAG, ICT |
| Testing | Flying Probe, Functional, JTAG, ICT | Yes |
| Conformal Coating | Yes | |
| Surface Finish | ENIG, ENEPIG, Soft Gold, Hard Gold, OSP, HASL, Lead-free HASL |
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| Panel Size | 9 x 12", 12 x 12", 12 x 18", 12 x 24" | |