Commercial & Industrial
Flexible Circuit Solutions
Custom commercial and industrial electronics solutions need to perform reliably for years to come under demanding conditions from the factory to the field.
We specialize in high-performance solutions to meet the most demanding requirements. From mid-volume quantities of production-quality industrial components, to high-volume quantities of commercialized products for end customers, Flex Interconnect Technologies can support your projects with unmatched quality and reliability.
2 LAYER FLEX WITH 0.4 MM BGA AND VIP. ORMET PASTE FOR VIA FILL.
This smart card application has a .4 mm BGA pattern on a double sided flex so it has to be via in pad (VIP). VIP requires sanding and planarization if you are doing any kind of plating. These processes stretched the flex material. To combat this we used ormet paste but we are now working more with Tatsuta paste for the same application.
2 layer Flex with ICT hinge design for flexibility and conformance to any topography. Low stress on solder joint.