Research & Development

We have forged a strong partnership with DuPont, Tatsuta, Insulectro, ICT and Averatek, which allows us to explore the newest materials and technologies before they hit the market. These strategic partnerships have enabled us to be the very first FPC company in the world to produce some of the latest technologies listed below.

• DuPont RS and APR Based Heaters
• Hitachi Stretchable Laminate Based Flex Circuit
• DuPont Ultrathin Laminate Based 40 layer Flex with “Any Layer Vias”
• ICT Hinged Flex Circuit
• Zeta-Lock
• HDI flex using Ormet paste and Tatsuta Paste Technology
• Embedded Capacitor in Flex using Dupont Interra Material
• Reinforced Thin Flex with Dupont LG Film
• LED applications using Coolam Laminate
• Adhesiveless Coverlay Based Rigid-Flex
• DuPont MT and MT+ Coverlay for High Thermal Conductivity
• Medical Sensors with 0.4 micron copper