Flex Interconnect Technologies:
Our Story

Since its humble beginnings in an empty warehouse in December of 1998, Flex Interconnect Technologies (FIT) has established itself as a leader in providing custom flexible circuit solutions to customers on the bleeding edge of technology.

Like other Silicon Valley startups of that era, FIT started small. The company’s first project took 3 weeks, earned $2,000, and covered the first month’s rent. It required applications engineering support for a young designer tasked with a 5-layer, shielded flex circuit with impedance control requirements.

Even that first project showcased how FIT would differentiate, leveraging deep engineering expertise. FIT supported the customer with Applications Engineering, stackup design, impedance calculations, and Design for Manufacturability review. On top of all of that, FIT was able to deliver finished parts within 3 weeks, with 100% yield.

President and CEO Chetan Shah soon brought on Vice President Dean Matsuo to help the company grow. While Shah focused on engineering, and growing the company’s “Solutions First” ethos, Matsuo oversaw the growing operations team.

Shah and Matsuo quickly grew Flex Interconnect Technologies into a leading manufacturer of custom flex, rigid-flex, and heater-flex solutions. Today, the company operates out of two buildings in Milpitas, California, supporting customers throughout Silicon Valley and all of North America with a state-of-the-art factory and top-tier engineering talent.

As the business continued to grow, so did FIT’s customers. To meet expanding customer needs, Shah forged integrated partnerships with carefully vetted overseas partners that adhere to FIT’s strict processes and quality requirements. As a result, FIT now supports high-volume, overseas production with the same confidence it has in its own, in-house, low volume capabilities. And for customers, the transition from prototyping to high-volume production is seamless.